Power consumption in many digital signal processor applications is just as significant as performance-and just as important for the designer to understand. DSP applications fall into two large groups with respect to power: line-powered systems, such as those used for communications infrastructure, and portable systems powered by batteries. Although performance requirements tend to dominate in the first group, there are power constraints that cannot be ignored. And with battery-operated applications, performance must always be evaluated relative to power. Since portable apps have multiple operating modes, they also tend to be more varied in their power requirements.

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Finally, Archos wanted silicon that was field-proven and could form the foundation for a robust multimedia platform, leading the company to base its core design around Texas Instruments' Digital Media processor family.

Figure 1(a) is the external view of the PSC module’s package and Figure 1(b) shows the cross section diagram of the PSC. The PSC module is a direct-bonded-copper (DBC) based transfer-molded package. A typical lead-frame-based package, presents a difficulty when changing the circuit topology since the lead-frame has to be changed. A DBC substrate, on the other hand, allows designers to easily create a new topology without sacrificing cost. Moreover, due to the thickness (0.68mm) of the aluminum oxide isolation layer, it is possible to for the DBC-packaged module to offer very low thermal resistance while maintaining an isolation voltage of 2.5 kV for 1 minute.

It is no secret that portable electronic devices will continue to become more sophisticated. Cell phones, for example, have become highly integrated, bringing together all kinds of functions, ranging from cameras and music players, to different ways of communicating, and various Internet-based connections.